International Conference on Physical Assurance and Inspection of Electronics (PAINE)
"International Conference on Physical Assurance and Inspection of Electronics (PAINE) offers an exciting venue to researchers and practitioners in the field of Hardware Security and Trust who research and develop physical assurance and analysis. PAINE brings together experts from government, instrumentation, original component manufacturers (OCMs), original equipment manufacturers (OEMs), and academic researchers together to share ideas and solutions to make electronics devices and systems safe and secure."
Topics of interest include, but are not limited to security primitives and systems security.
Submitted by Gregory Rigby
on
"International Conference on Physical Assurance and Inspection of Electronics (PAINE) offers an exciting venue to researchers and practitioners in the field of Hardware Security and Trust who research and develop physical assurance and analysis. PAINE brings together experts from government, instrumentation, original component manufacturers (OCMs), original equipment manufacturers (OEMs), and academic researchers together to share ideas and solutions to make electronics devices and systems safe and secure."
Topics of interest include, but are not limited to security primitives and systems security.
Submitted by Gregory Rigby
on